No Stencils. No Guesswork. Just Perfect Job Preparation.

This is a technical webinar dedicated to Keiron’s Preparation Software, the digital backbone behind LiFT precision solder paste printing. In a single session, configure both the printer and SPI simultaneously!

Our experts will walk you through how Keiron’s software enables precise, flexible, and efficient preparation of solder paste data — from PCB import to production-ready jobs — all without the constraints of stencils.

What you will learn:

• How to prepare digital paste files and accurately deposit solder paste, including built-in solder paste volume metrology
• How to control solder paste volume per individual pad, down to 1 nanoliter
• How to program solder paste deposition and metrology in a single step
• How to import and work with Gerber, ODB++, Keiron Paste Layer (JSON) and even existing stencil files
• How Keiron’s algorithms assign recipes per pad, with full flexibility to customize droplet placement
• How to efficiently set up panels, fiducials, identifiers, and inspection data
• What throughput levels are achievable with digital paste printing

Time: 16:00 CET (10:00 EST) 

Speakers:  Ruben van Oers and Daan van Hoogstraten 

Format: Live online webinar (Zoom)