Redefining Precision. First Time Right.

Introducing LiFT: The Future of Solder Paste Printing

If solder paste printing is causing defects, rework, yield loss, or constant process tuning, you are not alone. Across the industry, this single process step is still responsible for around 70% of all PCB assembly defects.

The reason is simple: stencil and jet printing rely on mechanical processes that struggle with fine pitch, high mix, frequent changeovers, and miniaturization. As boards become more complex, these limitations become production risks.

In this live Keiron webinar, we will show how Laser-Induced Forward Transfer (LiFT) eliminates the fundamental pain points of solder paste printing by replacing mechanical deposition with a fully digital, contactless process.

Any volume. Any size. Anywhere. Why compromise?

Date: January 14, 2026
Time: 15:00 CET (09:00 Eastern Standard Time)
Format: Live online webinar (Zoom)

What we will cover

Why stencil and jet printing struggle with modern PCB designs
How LiFT deposits solder paste with nanoscale precision, any volume, any size, anywhere
How LiFT removes the need for stencils, cleaning, nozzles, and standalone SPI
How manufacturers use LiFT to improve first-pass yield, uptime, and process stability
Real application examples where LiFT solves critical solder paste printing challenges

Whether you are printing 01005 components, mixed assemblies, or high-reliability electronics, LiFT is designed to deliver the right volume on the right pad — every time.