Frequently asked questions

Stencil printing is a traditional method used to apply solder paste onto printed circuit boards (PCBs) using a metal stencil. However, due to miniaturization and more advanced PCB designs, stencil printing struggles to keep up with the precision needed for smaller components.

Jet printing is a method that involves shooting solder paste onto the PCB in a non-contact manner. It uses specialized nozzles to dispense paste directly where needed, allowing more flexibility compared to stencils. However, jet printing requires consumables like nozzles that can get clogged, leading to maintenance issues and potential interruptions in production. This makes it less precise compared to Keiron's LiFT technology, which utilizes laser guidance for superior accuracy.

Stencil printing can be less effective for complex or dense PCB designs and requires frequent changeovers for different board layouts. Additionally, traditional stencil printing results in machine idle time of up to 60%, causing inefficiencies and hurting profitability. Stencils also wear out over time, compromising the consistency of solder paste application. Stencils also require regular cleaning and storage, which adds to maintenance time and costs.

Keiron's LiFT technology offers a fully digital, contactless solution that eliminates physical stencils entirely. Unlike stencil printing, which lacks precision for complex PCB designs, LiFT technology uses laser guidance to deposit solder paste with high accuracy. Unlike jet printing, which requires specialized solder pastes in dedicated tubes, LiFT works with standard solder pastes, reducing cost and complexity.

The old standard, SPI (Solder Paste Inspection), is used to inspect the quality of solder paste deposits after printing (reactive). Keiron's LiFT technology integrates SPM (Solder Paste Metrology) directly into the printing process for real-time validation. No separate SPI required, providing closed-loop quality control that ensures exceptional yield.

Traditional SMT printing relies on stencils, which need significant manual setup and maintenance. Jet printing offers more flexibility, but has issues like consumable clogging, lower precision, and increased maintenance. It also requires specialized solder pastes in dedicated tubes, unlike LiFT technology which uses readily available standard pastes. Keiron's LiFT technology moves beyond these limitations: it is laser-guided, provides nano precision, eliminates stencils and consumables, and integrates SPM for consistent, repeatable solder paste application. This results in greater control, efficiency, and flexibility for a range of PCB production needs.

Companies are adopting Keiron's LiFT technology for its efficiency, precision, and lower operating costs. Unlike stencil printing, which requires frequent changeovers, and jet printing, which has a higher error margin due to clogging nozzles, LiFT is fully digital and eliminates these compromises. It reduces idle time, improves yield rates, and integrates SPM for automatic quality control, making it an ideal choice for manufacturers facing increasing demands. 

SMT is a method for producing electronic circuits in which components are mounted directly onto the surface of PCBs. Stencil printing is the traditional method used to apply solder paste in the SMT process, while jet printing offers a more flexible, non-contact alternative that uses consumables prone to clogging. Keiron's LiFT technology represents the next evolution—a fully digital, contactless approach that addresses the inefficiencies of stencil printing and goes beyond jet printing by incorporating integrated quality control, greater precision, and ensuring repeatable, precise results.

Solder paste quality is vital because it directly impacts the reliability and performance of electronic assemblies. Poor quality paste can lead to defects and functional issues. Keiron's integrated SPM in the LIFT process ensures that solder paste quality is consistently monitored and maintained, achieving zero defects and high yield.

Accurate SMT printing is crucial for proper placement and soldering of electronic components, impacting the overall performance of the finished product. Keiron's LiFT technology ensures accurate solder paste deposition, through advanced control of paste depositing and laser-assisted alignment, resulting in superior placement accuracy and lower error margins.

Key trends in SMT printing include the shift toward fully digital printing methods, increased automation, and improved quality control through integrated AI-powered inspection. While jet printing is noted for flexibility, it is limited in precision and maintenance efficiency. Keiron's LiFT technology is at the forefront, offering a contactless, fully digital solution that boosts production uptime, minimizes errors, and aligns seamlessly with Industry 4.0 standards.

LiFT technology is a contactless print process that fully digitizes PCB manufacturing, integrating closed-loop quality control for high yields. Unlike traditional screen printing and even jet printing, LiFT enables precise control over print gap, solder paste depositing, and laser alignment, making it a revolutionary solution that addresses the inefficiencies of the SMT industry. It eliminates stencils, ensures highly accurate solder paste deposition, and provides a more consistent, efficient process, paving the way for the future of PCB assembly.

Keiron is revolutionizing the traditional analogue PCB assembly market by introducing a fully digital, tool-free solder paste printing solution. This innovation addresses challenges such as high idle times, the need for skilled staff, and the inefficiencies of analogue workflows. LiFT technology provides a fully automated, precise, and repeatable process, setting a new benchmark in SMT production.

Keiron's LiFT technology digitizes analogue processes, making it fully compatible with Industry 4.0 integration. It enhances production uptime, quality control, and adaptability, setting a new standard for the SMT industry and helping manufacturers transition to more modern, efficient workflows. 

Keiron's LiFT technology is compatible with standard solder pastes, requiring no special formulations or dedicated packaging. Unlike jet printing systems that need specialized pastes in custom tubes, LiFT works with readily available solder pastes, reducing cost and complexity.